Thermo-structural analysis of CMOS camera
Within the Amalia Team TSD performed a number of thermo-structural analysis to define the mechanical behavior of a CMOS camera in a variable temperature environment ranging between -100°C and +60°C.
The camera is subject to stress and strain imposed by the different thermal properties of the camera materials; it is currently under investigation the effect of thermal stress on the position of the focal plane and its subsequent impact on image quality.
The analysis is carried out in four different steps:
- Set pre-defined thermal conditions on the camera (i.e. temperature on specific points or heat flux on surfaces)
- Run thermal analysis to determine the full thermal distribution
- Set computed thermal field on the model
- Run static analysis to define stress and strain